EC2745ETTTS-25.000M TR

EC27 Series REGULATORY COMPLIANCE 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 2.5Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) ELECTRICAL SPECIFICATIONS Nominal Frequency 1.544MHz to 200MHz Frequency Tolerance/Stability Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C, Shock, and Vibration ±100ppm Maximum ±20ppm Maximum ±25ppm Maximum ±50ppm Maximum ±5ppm/year Maximum Aging at 25°C Operating Temperature Range Supply Voltage Input Current Output Voltage Logic High (VOH) Output Voltage Logic Low (VOL) Rise/Fall Time Duty Cycle -10°C to +70°C -40°C to +85°C 2.5Vdc ±5% 3mA Maximum over Nominal Frequency of 1.544MHz to 9.999999MHz 4mA Maximum over Nominal Frequency of 10MHz to 19.999999MHz 5mA Maximum over Nominal Frequency of 20MHz to 39.999999MHz 6mA Maximum over Nominal Frequency of 40MHz to 50MHz 10mA Maximum over Nominal Frequency of 50.000001MHz to 69.999999MHz 15mA Maximum over Nominal Frequency of 70MHz to 110MHz 35mA Maximum over Nominal Frequency of 110.000001MHz to 125MHz 45mA Maximum over Nominal Frequency of 125.000001MHz to 155MHz 58mA Maximum over Nominal Frequency of 155.000001MHz to 200MHz IOH = -4mA 90% of Vdd Minimum IOL = +4Ma 10% of Vdd Maximum Measured at 20% to 80% of waveform 6nSec Maximum over Nominal Frequency of 1.544MHz to 24MHz 4nSec Maximum over Nominal Frequency of 24.000001MHz to 50MHz 3nSec Maximum over Nominal Frequency of 50.000001MHz to 110MHz 2nSec Maximum over Nominal Frequency of 110.000001MHz to 200MHz Load Drive Capability Measured at 50% of waveform 50 ±10(%) 50 ±5(%) 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Output Control Input Voltage Logic High (Vih) Output Control Input Voltage Logic Low (Vil) Standby Current 90% of Vdd Minimum or No Connect to Enable Output. 10% of Vdd Maximum to Disable Output (High Impedance) Start Up Time Disabled Output, High Impedance 10µA Maximum 12kHz to 20MHz offset frequency 1pSec Maximum 10mSec Maximum Storage Temperature Range -55°C to +125°C RMS Phase Jitter Revised O: 6/1/2015 Page 2 of 12 www.ecliptek.com EC27 Series PART NUMBERING GUIDE Revised O: 6/1/2015 Page 3 of 12 www.ecliptek.com EC27 Series MECHANICAL DIMENSIONS SUGGESTED SOLDER PAD LAYOUT PIN CONNECTION 1 Tri-State 2 Case/Ground 3 Output 4 Supply Voltage All Tolerances are ±0.1 All Dimensions in Millimeters Revised O: 6/1/2015 Page 4 of 12 www.ecliptek.com EC27 Series OUTPUT WAVEFORM & TIMING DIAGRAM Revised O: 6/1/2015 Page 5 of 12 www.ecliptek.com EC27 Series TEST CIRCUIT FOR CMOS OUTPUT Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass Capacitor close to the package ground pin is required. Note 2: A low input capacitance (10Mohms), and High bandwidth (>300MHz) Passive probe is recommended. Note 3: Capacitance value (CL) includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. Revised O: 6/1/2015 Page 6 of 12 www.ecliptek.com EC27 Series TAPE & REEL DIMENSIONS Quantity per Reel: 1,000 Units All Dimensions in Millimeters Compliant to EIA-481 Revised O: 6/1/2015 Page 7 of 12 www.ecliptek.com EC27 Series RECOMMENDED SOLDER REFLOW METHOD HIGH TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum(TS MAX) - Time (tS) 150°C 175°C 200°C 60 - 180 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 3°C/Second Maximum Peak Temperature (TP) 260°C Maximum for 10 Seconds Maximum Target Peak Temperature(TP Target) 250°C +0/-5°C Time within 5°C of actual peak (tp) 20 - 40 Seconds Ramp-down Rate 6°C/Second Maximum Time 25°C to Peak Temperature (t) 8 Minutes Maximum Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 217°C 60 - 150 Seconds High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised O: 6/1/2015 Page 8 of 12 www.ecliptek.com EC27 Series RECOMMENDED SOLDER REFLOW METHOD LOW TEMPERATURE INFRARED/CONVECTION TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum Preheat - Temperature Minimum (Ts MIN) - Temperature Typical (Ts TYP) - Temperature Maximum(Ts MAX) - Time (ts) N/A 150°C N/A 60 - 120 Seconds Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) 5°C/Second Maximum Peak Temperature (TP) 240°C Maximum Target Peak Temperature (TP Target) 240°C Maximum 2 Times / 230˚C Maximum 1 Time Time within 5°C of actual peak (tp) 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time Ramp-down Rate 5°C/Second Maximum Time 25°C to Peak Temperature (t) N/A Moisture Sensitivity Level Level 1 Additional Notes Temperatures shown are applied to body of device. 150°C 200 Seconds Maximum Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) Revised O: 6/1/2015 Page 9 of 12 www.ecliptek.com